300dpi ASI purple logo

Magnetron Sputtering

Magnetron Sputtering

Reactive Sputtering Plasma

Magnetron Sputtering is a Plasma Vapor Deposition (PVD) process in which a plasma discharge is created by ionizing a process gas in a high vacuum environment. The positively charged ions from the plasma are attracted by an electrical field superimposed on the negatively charged electrode or “target”. The positive ions are accelerated by potentials ranging from a few hundred to a few thousand electron volts and strike the negative electrode with sufficient force to dislodge and eject atoms from the target through a momentum transfer process. These atoms will be ejected in a typical line-of-sight cosine distribution from the face of the target and will condense on all surfaces that are placed in proximity to the magnetron sputtering cathode.

Targets can be fabricated from almost any material that one subsequently wants to deposit on the surface of the component facing the electrode typically referred to as the “substrate”. The possibilities are very diverse, and you can sputter almost any material from conductive elemental metals, ceramics, glass, compounds and alloys. Conductive materials can be deposited using a direct current (DC) power supply and insulators can be deposited by using a radio frequency (RF) power supply. 13.56 MHz is one of the frequencies in the RF spectrum that has been allocated to “industrial applications” as is by far the most common frequency used in the sputtering application.

Magnetron Sputtering Model

Magnetron sputtering deposition uses a closed magnetic field to trap electrons, enhancing both the efficiency of the initial ionization process and allowing a plasma to be generated at lower pressures which reduces both background gas incorporation in the growing film and energy loses in the sputtered atom through gas collisions. This technique was pioneered in the late 1800’s and gained commercial success in the Microelectronic and Architectural Glass industry in the 1960’s and 1970’s. At the present time, magnetron sputtering sources are commercially available in many geometric configurations where the targets can be circular, rectangular, or tubular in form. Novel approaches based on sweeping the magnetic field over the surface of the target have been engineered and deployed to drive application-specific solutions.

For more information on Magnetron Sputtering Deposition or to discuss your project, call +1-412-469-8466 or contact us online.

Magnetron Sputtering

plasma magnetron

Magnetron Sputtering is a Plasma Vapor Deposition (PVD) process in which a plasma discharge is created by ionizing a process gas in a high vacuum environment. The positively charged ions from the plasma are attracted by an electrical field superimposed on the negatively charged electrode or “target”. The positive ions are accelerated by potentials ranging from a few hundred to a few thousand electron volts and strike the negative electrode with sufficient force to dislodge and eject atoms from the target through a momentum transfer process. These atoms will be ejected in a typical line-of-sight cosine distribution from the face of the target and will condense on all surfaces that are placed in proximity to the magnetron sputtering cathode.

Targets can be fabricated from almost any material that one subsequently wants to deposit on the surface of the component facing the electrode typically referred to as the “substrate”. The possibilities are very diverse, and you can sputter almost any material from conductive elemental metals, ceramics, glass, compounds and alloys. Conductive materials can be deposited using a direct current (DC) power supply and insulators can be deposited by using a radio frequency (RF) power supply. 13.56 MHz is one of the frequencies in the RF spectrum that has been allocated to “industrial applications” as is by far the most common frequency used in the sputtering application.

circular plasma

Magnetron sputtering deposition uses a closed magnetic field to trap electrons, enhancing both the efficiency of the initial ionization process and allowing a plasma to be generated at lower pressures which reduces both background gas incorporation in the growing film and energy loses in the sputtered atom through gas collisions. This technique was pioneered in the late 1800’s and gained commercial success in the Microelectronic and Architectural Glass industry in the 1960’s and 1970’s. At the present time, magnetron sputtering sources are commercially available in many geometric configurations where the targets can be circular, rectangular, or tubular in form. Novel approaches based on sweeping the magnetic field over the surface of the target have been engineered and deployed to drive application-specific solutions.

For more information on Magnetron Sputtering Deposition or to discuss your project, call +1-412-469-8466 or contact us online.

Angstrom Management

product manager for PVD Materials, magnetrons, and vacuum deposition systems. During his tenure

 

Mr. Bernick designed and manufactured a full line of systems including resistive evaporation, electron beam evaporation, chemical vapor deposition, and magnetron sputtering systems.

 

In 1988, Mr. Bernick founded Angstrom Sciences, Inc. The company supplied PVD Materials and specialized in designing circular cluster assemblies with unique geometries for superconductivity research. Since then, the ONYX® -series has developed into a full line of circular, linear, and cylindrical magnetron sputtering cathodes for research and development through full-production industrial applications.

This will close in 0 seconds

Sales Management

Customer Service, and Supply Chain, and is an accomplished business leader with proven results managing global brands through the utilization of strong market and industry knowledge, designing effective product strategies and championing exceptionally successful teams.

This will close in 0 seconds

Angstrom Management

issues, coordinates procedural manuals and shipping for all Angstrom Sciences’ products.

This will close in 0 seconds

Sales Management

product line. Mr. Bachman is an expert in PVD materials and offers support through our worldwide distribution network. Prior to joining the company in 2004, Mr. Bachman worked for seven years

 

as an Inside Sales Specialist and Corporate Buyer for TW Metals, a nationwide full-line service center and distributor.

 

Mr. Bachman has over 20 years of experience in the materials industry and holds a B.A. in Economics from the University of Pittsburgh.

This will close in 0 seconds

Sales Management

lines. His main areas of focus are on Sales and Customer Service Providing exceptional support to customers both directly and through our Global Distribution Network. Before joining the company in 2023 Patrick worked for FedEx, and his prior experience with Logistics is beneficial to our commitment to timely delivery both domestically and internationally.

 

Mr. Werkmeister holds a B.S. in Marketing from Kent State University.

This will close in 0 seconds

Production Management

in October 2004 and was promoted to the position of Assembly Supervisor in 2019. As supervisor, Craig oversees a team of assembly personnel to ensure the accuracy, quality, and on-time delivery of all fulfilled orders.

This will close in 0 seconds

Production Management

Computer Design as well as Machine Design. Mr. Bruce has designed everything from small hand powered tools to Continuous Barge Unloaders, and Rotary Railcar Dumpers. Mr. Bruce holds an Associates Degree in Computer Aided Design from PTI.

This will close in 0 seconds