Sputtering Technology
Sputtering Technology
Sputtering is a Physical Vapor Deposition process used to deposit very thin films onto a substrate for a wide variety of commercial and scientific purposes. Sputtering occurs when a process gas molecule is ionized and then used in a momentum transfer process to displace atoms of a material for the intended coating.
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These atoms then bond at the atomic level to a substrate to create a thin film layer. Several types of sputtering processes exist, including: ion beam, diode, and magnetron sputtering. Angstrom Sciences specializes in Magnetron Sputtering Technology.
In a magnetron sputtering application, the high voltage is delivered across a low pressure process gas (usually argon) in order to create a high-energy plasma discharge. This plasma emits a colorful halo of light often referred to as a “glow discharge” and consists of electrons (yellow) and gas ions (red).
These energized plasma ions strike a target composed of the desired coating material. The force causes atoms to eject from the target material and bond with those of the substrate.
Because sputtering takes place in a high-energy environment, it creates a virtually unbreakable bond between the film and its substrate at the atomic level, creating one of the thinnest, most uniform, and most cost-effective films possible.
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So, given the right tools, researchers and engineers in a variety of industries can use this technique to create a whole new generation of smaller, lighter, more durable products.
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For more information on Sputtering Technology, call us at +1-412-469-8466 or contact us online.
